Product family data sheet

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

ProDuCt DEsCriPtion

family is optimized for best-in-class

lumen output, efficacy and reliability at

high drive currents. XLamp CMA LeDs

share the same package design and

LeS sizes as Cree’s industry-leading

CXA2 Standard Density LeDs, enabling

lighting manufacturers to address a

range of performance requirements

for applications such as track,

downlight and outdoor lighting using

a single easy-to-use platform. XLamp

High-Current LeD Arrays are available

bins.

FEAturEs

• 9-mm optical source

• Mechanical and optical design

consistent with CXA15 and CXB15

LeDs

• Available in 70-, 80- and 90- and

95-minimum CRI options

binning

• Premium Color 2- and 3-step binning

• Forward voltage option: 36-v class

• 85 °C binning and characterization

• Maximum drive current: 1050 mA

• 115° viewing angle, uniform

chromaticity profile

• Top-side solder connections

• RoHS compliant

(e349212)

tAbLE oF ContEnts

Characteristics ............................................2

Operating Limits..........................................2

Flux Characteristics, easyWhite® Order

Codes and Bins ...........................................3

Flux Characteristics, Premium Color

Order Codes and Bins.................................4

Relative Spectral Power Distribution .........5

electrical Characteristics............................5

Relative Luminous Flux...............................6

Typical Spatial Distribution.........................6

easyWhite® Performance Groups -

Chromaticity ................................................7

Premium Color Performance Groups -

Chromaticity ................................................8

Cree easyWhite® Bins Plotted on the

1931 CIe Color Space.................................9

Cree Premium Color Bins Plotted on the

1931 CIe Color Space.............................. 10

Bin and Order Code Formats................... 12

Mechanical Dimensions .......................... 13

Thermal Design........................................ 14

Notes ........................................................ 15

Packaging................................................. 16