Chip-Scale Package

2

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

All voltages measured to GND unless otherwise noted.

VCC ..........................................................................-0.3V to +6V

OUT (open-drain) .....................................................-0.3V to +6V

Input/Output Current into Any Pin .......................................20mA

4-Pin/Bump UCSP (derate 3.8mW/°C above +70°C)....303mW

Operating Temperature Range ..........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range ............................-65°C to +160°C

Bump Reflow Temperature .............................................+235°C

ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

1.0

5.5

Supply Voltage Range

1.2

5.5

V

MAX6406/MAX6407/MAX6408

≤ 2.93V,

0.5

1.0

Supply Current

1.0

1.75

µA

Detector Threshold

Table 1

V

MAX6406/MAX6407/MAX6408

6.3

Voltage Threshold Hysteresis

MAX6409/MAX6410/MAX6411

9.5

mV

Detector Threshold Tempco

40

ppm/°C

0.8

2.0

MR Input

≤ 4.0V

V

MR Minimum Input Pulse Width

1µs

MR Glitch Rejection

100

ns

MR to OUT/OUT Delay

200

ns

MR Pullup Resistance

25

50

75

k

Ω

20

Propagation Delay

42

µs

Startup Time

88

µs

≥ 2.1V, OUT asserted

0.3

OUT Output Voltage Low

(MAX6406/MAX6408/MAX6409/

MAX6411)

≥ 1.2V, OUT asserted

0.4

V

OUT not asserted

≤ 4.38V, OUT not asserted

OUT Output Voltage High

(MAX6406/MAX6409)

≥ 4.5V, OUT not asserted

V