These devices are relatively immune to short-duration,

negative-going VCC transients (glitches).

The Typical Operating Characteristics show the

Maximum Transient Duration vs. Threshold Overdrive

graph, for which output pulses are not generated. The

graph shows the maximum pulse width that a negative-

going VCC transient may typically have before the

devices issue output signals. As the amplitude of the

transient increases, the maximum allowable pulse width

decreases.

UCSP Reliability

The chip-scale package (UCSP) represents a unique

packaging form factor that may not perform equally to a

packaged product through traditional mechanical reliabil-

ity tests. CSP reliability is integrally linked to the user’s

assembly methods, circuit board material, and usage

environment. The user should closely review these areas

when considering use of a CSP package. Performance

through Operating Life Test and Moisture Resistance

remains uncompromised as it is primarily determined by

the wafer-fabrication process.

Mechanical stress performance is a greater considera-

tion for a CSP package. CSPs are attached through

direct solder contact to the user’s PC board, foregoing

the inherent stress relief of a packaged product lead

frame. Solder joint contact integrity must be considered.

Information on Maxim’s qualification plan, test data, and

usage recommendations are detailed in the UCSP appli-

cation note, which can be found on Maxim’s website at

www.maxim-ic.com.

Chip Information

TRANSISTOR COUNT: 512

PROCESS: BiCMOS

Chip-Scale Package

_______________________________________________________________________________________

7

Figure 1. Interfacing to Different Logic Voltage Components

OUT

SUSPEND

µP

REGULATED 3.0V

(OPEN-DRAIN)

DC/DC

CONVERTER

GND

MAX6408/

MAX6411

3.6V

Li+

MR

UCSP

TOP VIEW AFTER ASSEMBLED ON PC BOARD (BUMPS AT THE BOTTOM)

( ) ARE FOR MAX6407/MAX6410

A1

A2

B1

B2

GND

MR

OUT (OUT)

MAX6406-

MAX6411

45 MIL

45 MIL

Pin Configuration