LC75878W

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2

Specifications

Parameter

Symbol

Conditions

Ratings

Unit

Maximum supply voltage

VDD max

VDD

0.3 to +7.0

V

VLCD max

VLCD

0.3 to +12.0

Input voltage

VIN1

CE, CL, DI, INH

0.3 to +7.0

V

VIN2

OSC

0.3 to VDD+0.3

VIN3

VLCD1, VLCD2, VLCD3, VLCD4

0.3 to VLCD+0.3

Output voltage

VOUT1

OSC, P1 to P4

0.3 to VDD+0.3

V

VOUT2

VLCD0, S1 to S75, COM1 to COM10

0.3 to VLCD+0.3

Output current

IOUT1

S1 to S75

300

A

IOUT2

COM1 to COM10

3

mA

IOUT3

P1 to P4

5

Allowable power dissipation

Pd max

Ta = 85

C

200

mW

Operating temperature

Topr

40 to +85

C

Storage temperature

Tstg

55 to +125

C

Parameter

Symbol

Conditions

Ratings

unit

min

typ

max

Supply voltage

VDD

VDD

2.7

6.0

V

VLCD

VLCD, When the display contrast

adjustment circuit is used

7.0

11.0

VLCD

VLCD, When the display contrast

adjustment circuit is not used

4.5

11.0

Output voltage

VLCD0

VLCD0

VLCD4

+4.5

VLCD

V

Input voltage

VLCD1

VLCD1

3/4(VLCD0

VLCD4)

VLCD0

V

VLCD2

VLCD2

2/4(VLCD0

VLCD4)

VLCD0

VLCD3

VLCD3

1/4(VLCD0

VLCD4)

VLCD0

VLCD4

VLCD4

0

1.5

Input high level voltage

VIH

CE, CL, DI, INH

0.8VDD

6.0

V

Input low level voltage

VIL

CE, CL, DI, INH

0

0.2VDD

V

Recommended external

resistance

ROSC

OSC

43

kΩ

Recommended external

capacitance

COSC

OSC

680

pF

Guaranteed oscillation range

fOSC

OSC

25

50

100

kHz

Data setup time

tds

CL, DI

[Figure 2]

160

ns

Data hold time

tdh

CL, DI

[Figure 2]

160

ns

CE wait time

tcp

CE, CL

[Figure 2]

160

ns

CE setup time

tcs

CE, CL

[Figure 2]

160

ns

CE hold time

tch

CE, CL

[Figure 2]

160

ns

High level clock pulse width

t

H

CL

[Figure 2]

160

ns

Low level clock pulse width

t

L

CL

[Figure 2]

160

ns

INH switching time

tc

INH, CE

[Figure 3], [ Figure 4], [ Figure 5]

10

s

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,

damage may occur and reliability may be affected.

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended

Operating Ranges limits may affect device reliability.