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FODM217AR2V Datasheet(PDF) 9 Page - ON Semiconductor |
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FODM217AR2V Datasheet(HTML) 9 Page - ON Semiconductor |
9 / 12 page FODM217 Series www.onsemi.com 8 REFLOW PROFILE Figure 36. Reflow Profile Profile Freature Pb- Free Assembly Profile Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60 –120 seconds Ramp-up Rate (tL to tP) 3°C/second max. Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 –150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp-down Rate (TP to TL) 6°C/second max. Time 25°C to Peak Temperature 8 minutes max. |
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