FAN6248

www.onsemi.com

4

MAXIMUM RATINGS

Stresses exceeding the absolute maximum ratings may damage the device. If any of these limits are exceeded, device

functionality should not be assumed. In addition, extended exposure to stresses above the recommended operating

conditions may affect device reliability.

Symbol

Parameter

Min.

Max.

Unit

Power Supply Input Pin Voltage

-0.3

30

V

Drain Sense Input Pin Voltage

-1

100

V

Gate Drive Output Pin Voltage

-0.3

30

V

Source Sense Input Pin Voltage

-0.4

0.4

V

0.625

W

Thermal Resistance (Junction-to-Ambient Thermal)

165

°C/W

Operating Junction Temperature

-40

150

°C

Storage Temperature Range

-60

150

°C

Lead Temperature (Soldering) 10 Seconds

260

°C

ESD

Electrostatic Discharge Capability

Human Body Model, ANSI / ESDA /

JEDEC JS-001-2012

4

kV

Charged Device Model, JESD22-C101

1.75

Notes:

1. All voltage values are with respect to the GND pin.

THERMAL CHARACTERISTICS

Recommended Operating Conditions

The Recommended Operating Conditions table defines the continuous conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the data sheet specifications. ON Semiconductor does

not recommend exceeding them or designing to Absolute Maximum Ratings

Symbol

Parameter

Min.

Max.

Unit

VDD Pin Supply Voltage to GND

0

27

V

Drain Sense Input Pin Voltage

-0.7

100

V

Source Sense Input Pin Voltage

-0.4

0.4

V

Operating Ambient Temperature

-40

+125

ºC

Notes:

frequency, load capacitance and ambient temperature.

3. Allowable operating ambient temperature can be limited by the power dissipation of FAN6248 related to switching

Rating

Symbol

Value

Unit

Thermal Characteristics

22

°C/W

Thermal Characteristics

165

°C/W