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TPS2236 Datasheet(PDF) 2 Page - Texas Instruments

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Part No. TPS2236
Description  ExpressCard POWER INTERFACE SWITCH
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TPS2236 Datasheet(HTML) 2 Page - Texas Instruments

 
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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS (Thermal Resistance =
°C/W)
TPS2231
TPS2236
SLVS536B – JULY 2004 – REVISED JANUARY 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
PACKAGED DEVICES(1)
TA
NUMBER OF CHANNELS
TSSOP
PowerPAD HTSSOP
QFN
Single
TPS2231PW
TPS2231PWP
TPS2231RGP(2)
–40
°C to 85°C
Dual
TPS2236DAP
(1)
The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2231PWPR).
(2)
Product preview stage of development
over operating free-air temperature range (unless otherwise noted)(1)
TPS223x
UNIT
VI(3.3VIN)
–0.3 to 6
V
Input voltage range for card
VI
VI(1.5VIN)
–0.3 to 6
V
power
VI(AUXIN)
–0.3 to 6
V
Logic input/output voltage
–0.3 to 6
V
VO(3.3VOUT)
–0.3 to 6
V
VO
Output voltage range
VO(1.5VOUT)
–0.3 to 6
V
VO(AUXOUT)
–0.3 to 6
V
Continuous total power dissipation
See Dissipation Rating Table
IO(3.3VOUT)
Internally limited
IO
Output current
IO(AUXOUT)
Internally limited
IO(1.5VOUT)
Internally limited
OC sink current
10
mA
PERST sink/source current
10
mA
TJ
Operating virtual junction temperature range
–40 to 120
°C
Tstg
Storage temperature range
–55 to 150
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
TPS2231
2
kV
Human body model
TPS2236, all pins except
Electrostatic discharge
(HBM) MIL-STD-883C
PERSTx and OCx
ESD
protection
TPS2236, PERSTx and OCx
1.5
kV
Charge device model (CDM)
500
V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
PACKAGE
POWER RATING
ABOVE TA = 25°C
POWER RATING
POWER RATING
PW (20)(1)
704.2 mW
7.41 mW/
°C
370.6 mW
259.5 mW
PWP (24)(1)
3153 mW
33.19 mW/
°C
1659.5 mW
1161.6 mW
RGP (20) (2)
3277.5 mW
34.5 mW/
°C
1725 mW
1207.3 mW
(1)
These devices are mounted on an JEDEC low-k board (2-oz. traces on surface), (The table is assuming that the maximum junction
temperature is 120
°C). The power pad on the device must be soldered down to the power pad on the board if best thermal performance
is needed.
(2)
Tis device is mounted on a JEDEC JESO51.5 high-k board (2 signal, 2 plane). The values assume a maxium junction temperature of
120
°C.
2


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