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ADT75ARMZ-REEL Datasheet(PDF) 8 Page - Analog Devices |
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ADT75ARMZ-REEL Datasheet(HTML) 8 Page - Analog Devices |
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8 / 25 page  Data Sheet ADT75 Rev. B | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating V DD to GND –0.3 V to +7 V SDA Input Voltage to GND –0.3 V to V DD + 0.3 V SDA Output Voltage to GND –0.3 V to V DD + 0.3 V SCL Input Voltage to GND –0.3 V to V DD + 0.3 V OS/ALERT Output Voltage to GND –0.3 V to V DD + 0.3 V Operating Temperature Range –55°C to +150°C Storage Temperature Range –65°C to +160°C Maximum Junction Temperature, T JMAX 150.7°C 8-Lead MSOP (RM-8) Power Dissipation1, 2 W MAX = (TJMAX − TA)/θJA Thermal Impedance3 θ JA, Junction-to-Ambient (Still Air) 205.9°C/W θ JC, Junction-to-Case 43.74°C/W 8-Lead SOIC (R-8) Power Dissipation1, 2 W MAX = (TJMAX − TA)/θJA Thermal Impedance3 θ JA, Junction-to-Ambient (Still Air) 157°C/W θ JC, Junction-to-Case 56°C/W IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 6 minutes maximum IR Reflow Soldering (Pb-Free Package) Peak Temperature 260°C (+0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 8 minutes maximum 1 Values relate to package being used on a standard 2-layer PCB. This gives a worst case θJAand θJC. Refer to Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 T A = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB- mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TEMPERATURE ( °C) 1.2 0.8 1.0 0.6 0.2 0.4 0 MAX PD = 3.4mW AT 150 °C Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature ESD CAUTION |
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