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ADT7302 Datasheet(PDF) 6 Page - Analog Devices

Part No. ADT7302
Description  Accurate, Micropower Digital Accurate, Micropower Digital
Download  17 Pages
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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ADT7302 Datasheet(HTML) 6 Page - Analog Devices

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ADT7302
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
V
DD to GND
−0.3 V to +7 V
Digital Input Voltage to GND
−0.3 V to V
DD + 0.3 V
Digital Output Voltage to GND
−0.3 V to V
DD + 0.3 V
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
6-Lead SOT-23 (RJ-6)
Power Dissipation1
W
MAX = (TJ max − TA
2
Thermal Impedance
)/θ
JA
θ
JA, Junction-to-Ambient (Still Air)
190.4°C/W
8-Lead MSOP (RM-8)
Power Dissipation1
W
MAX = (TJ max − TA
2)/θ
JA
Thermal Impedance3
θ
JA, Junction-to-Ambient (Still Air)
205.9°C/W
θ
JC, Junction-to-Case
43.74°C/W
IR Reflow Soldering
Peak Temperature
220°C (0°C/5°C)
Time at Peak Temperature
10 sec to 20 sec
Ramp-Up Rate
3°C/sec max
Ramp-Down Rate
−6°C/sec
Time 25°C to Peak Temperature
6 minutes max
IR Reflow Soldering—Pb-Free Package
Peak Temperature
260°C (0°C)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3°C/sec max
Ramp-Down Rate
−6°C/sec max
Time 25°C to Peak Temperature
8 minutes max
1 Values relate to the package being used on a standard 2-layer PCB. Refer
to Figure 3 for a plot of maximum power dissipation vs. ambient
temperature (TA).
2 T
A = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
TEMPERATURE (
°C)
1.2
1.0
0.8
0.6
0.4
0.2
0
SOT-23
MSOP
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION


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