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TM3C226K6R3ESA Datasheet(PDF) 11 Page - Vishay Siliconix |
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TM3C226K6R3ESA Datasheet(HTML) 11 Page - Vishay Siliconix |
11 / 16 page Molded Guide www.vishay.com Vishay Sprague Revision: 12-Sep-17 6 Document Number: 40074 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RECOMMENDED REFLOW PROFILES Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles. PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY Preheat / soak Temperature min. (Ts min.) 100 °C 150 °C Temperature max. (Ts max.) 150 °C 200 °C Time (ts) from (Ts min. to Ts max.) 60 s to 120 s 60 s to 120 s Ramp-up Ramp-up rate (TL to Tp) 3 °C/s max. 3 °C/s max. Liquidus temperature (TL) 183 °C 217 °C Time (tL) maintained above TL 60 s to 150 s 60 s to 150 s Peak package body temperature (Tp) Depends on case size - see table below Time (tp) within 5 °C of the specified classification temperature (TC) 20 s 30 s Time 25 °C to peak temperature 6 min max. 8 min max. Ramp-down Ramp-down rate (Tp to TL) 6 °C/s max. 6 °C/s max. 25 TIME (s) t s t L Time 25 °C to peak T L T p T C - 5 °C t p T s max. T s min. Preheat area Max. ramp-up rate = 3 °C/s Max. ramp-down rate = 6 °C/s PEAK PACKAGE BODY TEMPERATURE (Tp) CASE CODE PEAK PACKAGE BODY TEMPERATURE (Tp) SnPb EUTECTIC PROCESS LEAD (Pb)-FREE PROCESS A, B, C, V 235 °C 260 °C D, E, W 220 °C 250 °C PAD DIMENSIONS in inches [millimeters] CASE CODE A (MIN.) B (NOM.) C (NOM.) D (NOM.) MOLDED CHIP CAPACITORS, ALL TYPES A 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] B 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] C 0.118 [3.00] 0.094 [2.40] 0.118 [3.00] 0.307 [7.80] D 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] E 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] V 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] W 0.185 [4.70] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] A B C D |
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