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UCC21220

SLUSCK0 – NOVEMBER 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input bias pin supply voltage

VCCI to GND

–0.5

6

V

Driver bias supply

VDDA-VSSA, VDDB-VSSB

–0.5

20

V

Output signal voltage

OUTA to VSSA, OUTB to VSSB

–0.5

V

OUTA to VSSA, OUTB to VSSB, Transient for 100

ns

–5

V

Input signal voltage

INA, INB, DIS to GND

–0.5

V

INA, INB Transient to GND for 100ns

–5

V

(2)

–40

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCCI

VCCI Input supply voltage

3

5.5

V

VDDA,

VDDB

Driver output bias supply

9.2

18

V

Input, INA and INB, signal frequency

10

MHz

Junction Temperature

–40

130

°C

Ambient Temperature

–40

125

°C