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TUSB564RNQR Datasheet(PDF) 5 Page - Texas Instruments |
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TUSB564RNQR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 45 page 5 TUSB564 www.ti.com SLLSF29A – OCTOBER 2017 – REVISED OCTOBER 2017 Product Folder Links: TUSB564 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature and voltage range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply Voltage Range -0.3 4 V VIN_DIFF Differential Voltage at Differential Inputs ±2.5 V VIN_SE Input Voltage at Differential Inputs -0.5 4 V VIN_CMOS Input Voltage at CMOS Inputs -0.3 4 V TSTG Storage temperature -65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±5000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500 6.3 Recommended Operating Conditions over operating free-air temperature and voltage range (unless otherwise noted) MIN NOM MAX UNIT TA Ambient temperature for TUSB564 0 70 °C TA Ambient temperature for TUSB564I -40 85 °C VCC Supply voltage 3 3.3 3.6 V VCC_RAMP Power supply ramp 0.1 100 ms VI2C Supply that external resistors on SDA and SCL are pulled up to 1.7 3.6 V VPSN Power supply noise on VCC 100 mV (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TUSB564 UNIT RNQ (WQFN) 40 PINS RθJA Junction-to-ambient thermal resistance 37.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 20.7 °C/W RθJB Junction-to-board thermal resistance 9.5 °C/W ΨJT Junction-to-top characterization parameter 0.2 °C/W ΨJB Junction-to-board characterization parameter 9.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.3 °C/W |
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