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OPA202, OPA2202, OPA4202

www.ti.com

SBOS812 – OCTOBER 2017

Product Folder Links: OPA202 OPA2202 OPA4202

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that swing more than 0.5 V beyond the supply rails must be

current-limited to 10 mA or less.

(3)

Input terminals are anti-parallel diode-clamped to each other. Input signals that cause differential voltages of swing more than ± 0.5 V

must be current-limited to 10 mA or less.

(4)

Short-circuit to ground, one amplifier per package.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage,

Single-supply

40

V

Dual-supply

±20

Signal input pins

Voltage

(V–) – 0.5

(V+) + 0.5

±0.5

Current

±10

mA

Continuous

–40

125

°C

125

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2500

V

±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, [ (V+) – (V–) ]

Single-supply

4.5

36

V

Dual-supply

±2.25

±18

Specified temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: OPA202

OPA202

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

136

°C/W

Junction-to-case (top) thermal resistance

74

°C/W

Junction-to-board thermal resistance

62

°C/W

Junction-to-top characterization parameter

19.7

°C/W

Junction-to-board characterization parameter

54.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W