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LP87322FRHDRQ1 Datasheet(PDF) 6 Page - Texas Instruments |
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LP87322FRHDRQ1 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 73 page  6 LP87322B-Q1, LP87322D-Q1, LP87322E-Q1, LP87322F-Q1 SNVSAC5 – SEPTEMBER 2017 www.ti.com Product Folder Links: LP87322B-Q1 LP87322D-Q1 LP87322E-Q1 LP87322F-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground. 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN_Bx, VANA Voltage on power connections (must use the same input supply) –0.3 6 V VIN_LDOx Voltage on power connections –0.3 6 V SW_Bx Voltage on buck switch nodes –0.3 (VIN_Bx + 0.3 V) with 6-V maximum V FB_Bx Voltage on buck voltage sense nodes –0.3 (VANA + 0.3 V) with 6-V maximum V VOUT_LDOx Voltage on LDO output -0.3 (VIN_LDOx + 0.3 V) with 6-V maximum V SDA, SCL, nINT, EN Voltage on logic pins (input or output pins) –0.3 6 V PGOOD, GPO, CLKIN (GPO2) Voltage on logic pins (input or output pins) –0.3 (VANA + 0.3 V) with 6-V maximum V TJ-MAX Junction temperature −40 150 °C Tstg Storage temperature –65 150 Maximum lead temperature (soldering, 10 seconds) 260 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 All pins ±500 Corner pins (1, 7, 8, 14, 15, 21, 22, 28) ±750 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT INPUT VOLTAGE VIN_Bx, VANA Voltage on power connections (must use the same input supply) 2.8 5.5 V VIN_LDOx Voltage on LDO inputs 2.5 5.5 V EN, nINT Voltage on logic pins (input or output pins) 0 5.5 V CLKIN Voltage on logic pins (input pin) 0 VANA with 5.5-V maximum V PGOOD, GPO, GPO2 Voltage on logic pins (output pins) 0 VANA V SCL, SDA Voltage on I2C interface, Standard (100 kHz), Fast (400 kHz), Fast+ (1 MHz), and High-Speed (3.4 MHz) Modes 0 1.95 V Voltage on I2C interface, Standard (100 kHz), Fast (400 kHz), and Fast+ (1 MHz) Modes 0 VANA with 3.6-V maximum V TEMPERATURE TJ Junction temperature −40 140 °C TA Ambient temperature −40 125 °C |
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