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LMK60E2-150M00SIAT Datasheet(PDF) 4 Page - Texas Instruments |
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LMK60E2-150M00SIAT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 18 page 4 LMK60E2-150M, LMK60E0-156257 LMK60A0-148351, LMK60A0-148M SNAS687C – JUNE 2016 – REVISED NOVEMBER 2017 www.ti.com Product Folder Links: LMK60E2-150M LMK60E0-156257 LMK60A0-148351 LMK60A0-148M Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Device supply voltage 3.135 3.3 3.465 V TA Ambient temperature –40 25 85 °C TJ Junction temperature 120 °C tRAMP VDD power-up ramp time 0.1 100 ms (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The package thermal resistance is calculated on a 4 layer JEDEC board. (3) Connected to GND with 3 thermal vias (0.3-mm diameter). (4) ψJB (junction to board) is used when the main heat flow is from the junction to the GND pad. See the Layout Guidelines section for more information on ensuring good system reliability and quality. 6.4 Thermal Information THERMAL METRIC(1) LMK60XX (2) (3) (4) UNIT SIA (QFM) 6 PINS Airflow (LFM) 0 Airflow (LFM) 200 Airflow (LFM) 400 RθJA Junction-to-ambient thermal resistance 55.2 46.4 43.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 34.6 n/a n/a °C/W RθJB Junction-to-board thermal resistance 37.7 n/a n/a °C/W ψJT Junction-to-top characterization parameter 11.3 17.6 22.5 °C/W ψJB Junction-to-board characterization parameter 37.7 41.5 40.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) Refer to Parameter Measurement Information for relevant test conditions. (2) On-chip power dissipation should exclude 40 mW, dissipated in the 150 Ω termination resistors, from total power dissipation. 6.5 Electrical Characteristics - Power Supply (1) VDD = 3.3 V ± 5%, TA = -40C to 85°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IDD Device current consumption LVPECL(2) 162 208 mA LVDS 152 196 HCSL 155 196 IDD-PD Device current consumption when output is disabled OE = GND 136 mA (1) Refer to Parameter Measurement Information for relevant test conditions. (2) An output frequency over fOUT max spec is possible, but output swing may be less than VOD min spec. (3) Ensured by characterization. 6.6 LVPECL Output Characteristics (1) VDD = 3.3 V ± 5%, TA = -40C to 85°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fOUT Output frequency(2) 10 800 MHz VOD Output voltage swing (VOH – VOL) (2) 700 800 1200 mV VOUT, DIFF, PP Differential output peak-to-peak swing 2 × |VOD| V VOS Output common-mode voltage VDD – 1.55 V tR / tF Output rise/fall time (20% to 80%)(3) 150 250 ps ODC Output duty cycle(3) 45% 55% |
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