10

ISL84684

Thin Dual Flat No-Lead Plastic Package (TDFN)

//

NX (b)

SECTION "C-C"

FOR ODD TERMINAL/SIDE

e

CC

5

CL

TERMINAL TIP

(A1)

BOTTOM VIEW

A

6

AREA

INDEX

C

C

0.10

0.08

SIDE VIEW

0.15

2X

E

A

B

C

0.15

D

TOP VIEW

CB

2X

6

8

AREA

INDEX

NX L

E2

E2/2

REF.

e

N

(Nd-1)Xe

(DATUM A)

(DATUM B)

5

0.10

8

7

D2

B

A

C

N-1

12

PLANE

SEATING

C

A

A3

NX b

D2/2

NX k

L1

9 L

M

L10.3x3A

10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.70

0.75

0.80

-

A1

-

-

0.05

-

A3

0.20 REF

-

b

0.20

0.25

0.30

5,8

D

3.00 BSC

-

D2

2.20

2.30

2.40

7,8

E

3.00 BSC

-

E2

1.40

1.50

1.60

7,8

e

0.50 BSC

-

k0.25

-

-

-

L

0.20

0.30

0.40

8

L1

-

-

0.15

1

N10

2

Nd

5

3

Rev. 1 6/04

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd refers to the number of terminals on D.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

8. Nominal dimensions are provided to assist with PCB Land

Pattern Design efforts, see Intersil Technical Brief TB389.

9. Depending on the method of lead termination at the edge of the

package, a maximum 0.15mm pull back (L1) maybe present. L

minus L1 to be equal to or greater than 0.3mm.

10. COMPLIANT TO JEDEC MO-229-WEED-3 except for

dimensions E2 & D2.