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CY7C1373C-133BGC Datasheet(PDF) 11 Page - Cypress Semiconductor

Part # CY7C1373C-133BGC
Description  18-Mbit (512K x 36/1M x 18) Flow-Through SRAM with NoBL Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1373C-133BGC Datasheet(HTML) 11 Page - Cypress Semiconductor

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CY7C1371C
CY7C1373C
Document #: 38-05234 Rev. *D
Page 11 of 33
TDI
-
U3
P5
JTAG serial
input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the rising
edge of TCK. If the JTAG feature is not being utilized, this
pin can be left floating or connected to VDD through a pull
up resistor. This pin is not available on TQFP packages.
TMS
-
U2
R5
JTAG serial
input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the rising
edge of TCK. If the JTAG feature is not being utilized, this
pin can be disconnected or connected to VDD. This pin is
not available on TQFP packages.
TCK
-
U4
R7
JTAG-Clock
Clock input to the JTAG circuitry. If the JTAG feature is
not being utilized, this pin must be connected to VSS. This
pin is not available on TQFP packages.
NC
1,2,3,6,7,16,
25,28,29,30,
38,39,42,43,
51,52,53,56,
57,66,75,78,
79,95,96,14
B1,B7,C1,
C7,D2,D4,
D7,E1,E6,
H2,F2,G1,
G6,
H7,J3,J5,
K1,K6,L4,
L2,L7,M6,
N2,N7,L7,
P1,P6,R1,
R5,R7,T1,
T4,U6
A1,A5,B1,
B4,B11,
C1,C2,C10,
D1,D10,E1,
E10,F1,F10,
G1,G10,H1,
H3,H9,H10,
J2,J11,K2,
K11,L2,L11,
M2,M11,N2,
N5,N6,N7,
N10,N11,P1,
P2,P11,R2
-
No Connects. Not internally connected to the die.
18M,36M, 72M, 144M and 288M are address expansion
pins and are not internally connected to the die.
NC / VDD
––
H2
Can either be left unconnected or connected to VDD.
Must not be connected to VSS.
CY7C1373C–Pin Definitions (continued)
Name
TQFP
BGA
fBGA
I/O
Description


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