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AD4001 Datasheet(PDF) 9 Page - Analog Devices

Part # AD4001
Description  Precision, Differential SAR ADCs
Download  37 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD4001 Datasheet(HTML) 9 Page - Analog Devices

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Data Sheet
AD4001/AD4005
Rev. B | Page 9 of 37
ABSOLUTE MAXIMUM RATINGS
Note that the input overvoltage clamp cannot sustain the
overvoltage condition for an indefinite amount of time.
Table 5.
Parameter
Rating
Analog Inputs
IN+, IN− to GND1
−0.3 V to VREF + 0.4 V
or ±50 mA
Supply Voltage
REF, VIO to GND
−0.3 V to +6.0 V
VDD to GND
−0.3 V to +2.1 V
VDD to VIO
−6 V to +2.4 V
Digital Inputs to GND
−0.3 V to VIO + 0.3 V
Digital Outputs to GND
−0.3 V to VIO + 0.3 V
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
Lead Temperature Soldering
260°C reflow as per
JEDEC J-STD-020
ESD Ratings
Human Body Model
4 kV
Machine Model
200 V
Field Induced Charged Device Model
1.25 kV
1
See the Analog Inputs section for an explanation of IN+ and IN−.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 6. Thermal Resistance
Package Type1
θJA2
θJC3
Unit
RM-10
147
38
°C/W
CP-10-9
114
33
°C/W
1
Test Condition 1: thermal impedance simulated values are based upon use
of 2S2P JEDEC PCB. See the Ordering Guide.
2
θJA is the natural convection junction-to-ambient thermal resistance
measured in a one cubic foot sealed enclosure.
3
θJC is the junction-to-case thermal resistance.
ESD CAUTION


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