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145 Datasheet(PDF) 6 Page - STMicroelectronics |
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145 Datasheet(HTML) 6 Page - STMicroelectronics |
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Prepared by JM Bugnard Page 4/9 Process Change/ Transfer Qualification report n° QASO8N91 2. QUALIFICATION PLAN 2.1 PROCESS QUALIFICATION REQUIREMENTS 2.1.1 Flow Chart comparison (1) yes [ X ] no [ ] N/A [ ] 2.1.2 Control Plan comparison (1) yes [ X ] no [ ] N/A [ ] 2.1.3 FMEA study (1) yes [ X ] no [ ] N/A [ ] 2.1.4 Process construction analysis (1) yes [ X ] no [ ] N/A [ ] 2.1.5 Quantity of qualification lots [ ] 1 [ ] 2 [ X ] 3 [ ] 4 2.1.6 Critical parametric parameters analysis (Cpk) yes [X ] no [ ] N/A [ ] Bond pull test, Bond shear test. 2.1.7 Non critical parameters analysis (Mean) yes [X ] no [ ] N/A [ ] Note 1: as described in related ADCS procedure 2.2 Test Vehicles (TV) description. Line Sales Type P&L Dice size Package Assy Reliab plant Lot # 0431* TL431CD 71 1.38x1.12mm SO8 ST Muar Grenoble +Muar 1 0158* LM358D 71 1.07x 1.01 SO8 ST Muar Grenoble 1 0082* TL082CD 71 1.74x1.48 SO8 ST Muar Muar 1 * shrinked die version 2.3 FINAL TEST QUALIFICATION REQUIREMENTS [ x ] yes [ ] no 2.3.1 Quantity of qualification lots [ ] 1 [X ] 2 [ ] 3 2.3.2 Lot average yield data: [ ] 1 [ X ] 2 [ ] 3 2.3.3 Package type SO8 2.3.4 Parameter distributions [X ] N/A [ ] LotA [ ] LotB [ ] Lot C 2.3.4.1List of parameters: 2.3.4.2 Qualification criteria: N/A 2.4 BENCH MEASUREMENTS QUALIFICATION REQUIREMENTS [ X] yes [ ] no [ ]N/A Construction analysis conforms to ST specification. 2.5 SPECIFIC TESTS QUALIFICATION REQUIREMENTS [] yes [ ] no [x] N/A 2.5.1 ESD [] yes [ x ] no 2.5.1 Latch-up [] yes [ x ] no |
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