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145 Datasheet(PDF) 6 Page - STMicroelectronics

Part No. 145
Description  PRODUCT/PROCESS CHANGE NOTIFICATION
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

145 Datasheet(HTML) 6 Page - STMicroelectronics

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Prepared by JM Bugnard
Page 4/9
Process Change/ Transfer
Qualification report n° QASO8N91
2. QUALIFICATION PLAN
2.1 PROCESS QUALIFICATION REQUIREMENTS
2.1.1 Flow Chart comparison (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.2 Control Plan comparison (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.3 FMEA study (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.4 Process construction analysis (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.5 Quantity of qualification lots
[ ] 1
[ ] 2
[ X ] 3
[ ] 4
2.1.6 Critical parametric parameters analysis (Cpk)
yes [X ]
no [ ]
N/A [ ]
Bond pull test, Bond shear test.
2.1.7 Non critical parameters analysis (Mean)
yes [X ]
no [ ]
N/A [ ]
Note 1: as described in related ADCS procedure
2.2 Test Vehicles (TV) description.
Line
Sales Type
P&L
Dice size
Package
Assy
Reliab plant
Lot #
0431*
TL431CD
71
1.38x1.12mm
SO8
ST Muar
Grenoble +Muar
1
0158*
LM358D
71
1.07x 1.01
SO8
ST Muar
Grenoble
1
0082*
TL082CD
71
1.74x1.48
SO8
ST Muar
Muar
1
* shrinked die version
2.3 FINAL TEST QUALIFICATION REQUIREMENTS
[ x ] yes
[ ] no
2.3.1 Quantity of qualification lots
[ ] 1
[X ] 2
[ ] 3
2.3.2 Lot average yield data:
[ ] 1
[ X ] 2
[ ] 3
2.3.3 Package type
SO8
2.3.4 Parameter distributions
[X ] N/A
[ ] LotA [ ] LotB
[ ] Lot C
2.3.4.1List of parameters:
2.3.4.2 Qualification criteria: N/A
2.4 BENCH MEASUREMENTS QUALIFICATION REQUIREMENTS
[ X] yes
[ ] no
[ ]N/A
Construction analysis conforms to ST specification.
2.5 SPECIFIC TESTS QUALIFICATION REQUIREMENTS [] yes
[ ] no
[x] N/A
2.5.1 ESD
[] yes
[ x ] no
2.5.1 Latch-up
[] yes
[ x ] no


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