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145 Datasheet(PDF) 5 Page - STMicroelectronics

Part No. 145
Description  PRODUCT/PROCESS CHANGE NOTIFICATION
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

145 Datasheet(HTML) 5 Page - STMicroelectronics

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Process Change/ Transfer
Qualification report n° QASO8N91
1. PROCESS MAIN SPECIFI CATION CHANGE
1.1 Process change description.
1.1.1 Nature of Change: Leadfree plating NiPdAu preplated leadframe and glue change (Hitachi
4900)
1.1.2
Reason for Change: To be compliant with Environmental directives.
1.1.3
Affected process: SO8 assembled in ST Muar
1.1.4
Affected products: All standard linear devices assembled in SO8
1.1.5
Implementation date: April 2003
1.2 DETAILLED DESCRIPTION OF CHANGE
New Process
Current Process
Assembly site
ST Muar (Malaysia)
ST Muar (Malaysia)
Assembly flow + Control Plan
7124337
7071671
Frame (material)
Copper +
NiPdAu preplating
Copper
Die attach material
Hitachi 4900ST
Ablebond 8390
Wire material
Wire diameter
Gold
1 MIL
Gold
1 MIL
Mold compound
MP8000 CH4
MP8000 CH4
Wire bond method
Thermosonic
Thermosonic
Lead finishing
NiPdAu (preplated)
Tin plating (SnPb85/15)
LEAD-FREE components are defined by STMicroelectronics as ECOPACK® components.
The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used
the lead finishing of components.
The identification of ECOPACK products will be achieved through specific labelling on
component boxes.
Whenever possible, the letter “E” will be added in the marking pattern beside the ST logo on the package
body.
1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR
RELIABILITY DATA
No effect on solderability: ECOPACK components are solderable with both current SnPb and AgSnCu lead -
free PCB assembly processes.
Reliability improvement: In addition to the change of connection coating, a change in materials (glue) occurs
in SO Narrow in order to meet the higher soldering tem perature constraints required for lead-free soldering using,
in particular, the IPC/JEDEC JSTD020B
standard as re ference.


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