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145 Datasheet(PDF) 5 Page - STMicroelectronics |
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145 Datasheet(HTML) 5 Page - STMicroelectronics |
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Prepared by JM Bugnard Page 3/9 Process Change/ Transfer Qualification report n° QASO8N91 1. PROCESS MAIN SPECIFI CATION CHANGE 1.1 Process change description. 1.1.1 Nature of Change: Leadfree plating NiPdAu preplated leadframe and glue change (Hitachi 4900) 1.1.2 Reason for Change: To be compliant with Environmental directives. 1.1.3 Affected process: SO8 assembled in ST Muar 1.1.4 Affected products: All standard linear devices assembled in SO8 1.1.5 Implementation date: April 2003 1.2 DETAILLED DESCRIPTION OF CHANGE New Process Current Process Assembly site ST Muar (Malaysia) ST Muar (Malaysia) Assembly flow + Control Plan 7124337 7071671 Frame (material) Copper + NiPdAu preplating Copper Die attach material Hitachi 4900ST Ablebond 8390 Wire material Wire diameter Gold 1 MIL Gold 1 MIL Mold compound MP8000 CH4 MP8000 CH4 Wire bond method Thermosonic Thermosonic Lead finishing NiPdAu (preplated) Tin plating (SnPb85/15) LEAD-FREE components are defined by STMicroelectronics as ECOPACK® components. The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used the lead finishing of components. The identification of ECOPACK products will be achieved through specific labelling on component boxes. Whenever possible, the letter “E” will be added in the marking pattern beside the ST logo on the package body. 1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR RELIABILITY DATA No effect on solderability: ECOPACK components are solderable with both current SnPb and AgSnCu lead - free PCB assembly processes. Reliability improvement: In addition to the change of connection coating, a change in materials (glue) occurs in SO Narrow in order to meet the higher soldering tem perature constraints required for lead-free soldering using, in particular, the IPC/JEDEC JSTD020B standard as re ference. |
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