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S-1312A22-A4T2U3 Datasheet(PDF) 11 Page - Seiko Instruments Inc |
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S-1312A22-A4T2U3 Datasheet(HTML) 11 Page - Seiko Instruments Inc |
11 / 47 page LOW CURRENT CONSUMPTION HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR Rev.2.3_01 S-1312 Series 11 Power Dissipation of HSNT-4 (1010) and HSNT-4 (0808) (Reference) Power dissipation of package differs depending on the mounting conditions. Consider the power dissipation characteristics under the following conditions as reference. [Mounted board] (1) Board size: 40 mm × 40 mm × t0.8 mm (2) Board material: Glass epoxy resin (four layers) (3) Wiring ratio: 50% (4) Test conditions: When mounted on board (wind speed: 0 m/s) (5) Land pattern: Refer to the recommended land pattern Drawing code: PL004-A-L-SD (HSNT-4 (1010)), PK004-A-L-SD (HSNT-4 (0808)) 0 50 100 150 0 Ambient Temperature (Ta) [ °C] 400 200 600 1000 800 1200 HSNT-4 (1010) HSNT-4 (0808) Figure 9 Power Dissipation of Package (When Mounted on Board) Table 11 Condition Power Dissipation (Reference) Thermal Resistance Value ( θj−a) HSNT-4 (1010) (When mounted on board) 870 mW 115 °C/W HSNT-4 (0808) (When mounted on board) 850 mW 117 °C/W |
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