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S-13D1B1218-M6T1U3 Datasheet(PDF) 10 Page - Seiko Instruments Inc |
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S-13D1B1218-M6T1U3 Datasheet(HTML) 10 Page - Seiko Instruments Inc |
10 / 45 page SUPER-SMALL PACKAGE 2-CIRCUIT BUILT-IN DELAY FUNCTION HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR S-13D1 Series Rev.1.3_01 10 Power Dissipation of HSNT-6 (1212) (Reference) Power dissipation of package differs depending on the mounting conditions. Consider the power dissipation characteristics under the following conditions as reference. [Mounted board] (1) Board size: 40 mm × 40 mm × t0.8 mm (2) Board material: Glass epoxy resin (four layers) (3) Wiring ratio: 50% (4) Test conditions: When mounted on board (wind speed: 0 m/s) (5) Land pattern: Refer to the recommended land pattern (drawing code: PM006-A-L-SD) 0 50 100 150 0 Ambient Temperature (Ta) [ °C] 400 200 600 1000 800 1200 Figure 10 Power Dissipation of Package (When Mounted on Board) Table 9 Condition Power Dissipation (Reference) Thermal Resistance Value ( θj−a) HSNT-6 (1212) (When mounted on board) 1000 mW 100 °C/W |
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