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UA741 Datasheet(PDF) 3 Page - Texas Instruments

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Part No. UA741
Description  GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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UA741 Datasheet(HTML) 3 Page - Texas Instruments

 
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µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
µA741Y chip information
This chip, when properly assembled, displays characteristics similar to the
µA741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJmax = 150°C.
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
+
OUT
IN +
IN –
VCC+
(7)
(3)
(2)
(6)
(4)
VCC –
(5)
(1)
OFFSET N2
OFFSET N1
45
36
(1)
(8)
(7)
(6)
(5)
(4)
(3)
(2)


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