6

TPS7H1101A-SP

SLVSDW6A – APRIL 2017 – REVISED AUGUST 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

–0.3

7.5

V

FB, COMP, PCL, CS, EN

–0.3

Output voltage

–0.3

7.5

V

PG terminal sink current

0.001

5

mA

–55

150

°C

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

±2000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating junction temperature

–55

125

°C

(1)

Do not allow package body temperature to exceed 265°C at any time or permanent damage may result.

(2)

Maximum power dissipation may be limited by overcurrent protection.

6.4 Thermal Information

TPS7H1101A-SP

UNIT

HKR (CFP)

16 PINS

Junction-to-case (bottom) thermal resistance

0.6

°C/W