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RT8901PS Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT8901PS Datasheet(HTML) 9 Page - Richtek Technology Corporation |
9 / 10 page RT8901 9 DS8901-03 October 2013 www.richtek.com © Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. For recommended operating conditions specification, the maximum junction temperature is 125 °C. The junction to ambient thermal resistance θJA is layout dependent. For SOP-8 package, the thermal resistance θJA is 120°C/W on the standard JEDEC 51-7 four layers thermal test board. The maximum power dissipation at TA =25 °C can be calculated by following formula : PD(MAX) = ( 125 °C - 25°C ) / (120°C/W) = 0.833W for SOP-8 package The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. The Figure 7 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. Figure 7. Derating Curve 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 15304560 7590 105 120 135 Ambient Temperature (°C) Four Layers PCB |
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