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DRV5032 Datasheet(PDF) 5 Page - Texas Instruments |
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DRV5032 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 33 page 5 DRV5032 www.ti.com SLVSDC7A – APRIL 2017 – REVISED MAY 2017 Product Folder Links: DRV5032 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Power supply voltage VCC –0.3 5.5 V Power supply voltage slew rate VCC Unlimited V / µs Output voltage OUT, OUT1, OUT2 –0.3 VCC + 0.3 V Output current OUT, OUT1, OUT2 –5 5 mA Magnetic flux density, BMAX Unlimited T Junction temperature, TJ 105 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±6000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±750 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Power supply voltage 1.65 5.5 V VO Output voltage 0 5.5 V IO Output current –5 5 mA TA Operating ambient temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) DRV5032 UNIT SOT-23 (DBZ) X2SON (DMR) 3 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 356 159 °C/W RθJC(top) Junction-to-case (top) thermal resistance 128 77 °C/W RθJB Junction-to-board thermal resistance 94 102 °C/W ψJT Junction-to-top characterization parameter 11.4 0.9 °C/W ψJB Junction-to-board characterization parameter 92 100 °C/W |
Similar Part No. - DRV5032_17 |
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Similar Description - DRV5032_17 |
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