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DAC38RF80_017 Datasheet(PDF) 51 Page - Texas Instruments

Part # DAC38RF80_017
Description  Dual- or Single-Channel, Single-Ended or Differential Output, 14-Bit, 9-GSPS, RF-Sampling DAC With JESD204B Interface and On-Chip PLL
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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DAC38RF80_017 Datasheet(HTML) 51 Page - Texas Instruments

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51
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
www.ti.com
SLASEA3C – DECEMBER 2016 – REVISED JULY 2017
DAC38RF83 DAC38RF93
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
program that particular DAC chip to use phase tolerance window “00”. This mapping is indicated in the figure
with the label “θ1|θ12|θ2: window=00”. Having programmed the device to use window “00”, all future SYSREF
events that occur in θ1 or θ2 would trigger the LMFC and frame clock to be aligned using the following rising
clock edge as the alignment reference (as indicated by the red arrow pointing to rising clock edge “R” and
labeled “Window=00/01 alignment edge”).
The full extent of each phase tolerance window is indicated in the figure using “box and whisker” plots. For the
“window=00” example, the “box” portion of the plot indicates that the phase tolerance window is centered on θ12
(to be precise on the boundary between θ1 and θ2) and the “whisker” portion indicates that even if the rising
edge of SYSREF occurs as early as the preceding θ4 or as late as the following θ3 it still results in LMFC and
frame clock alignment to the same rising clock edge indicated by the red arrow labeled “Window=00/01
alignment edge”. When programmed for phase tolerance window “00”, the DAC chip is tolerant to variations in
the SYSREF timing ranging from a rising SYSREF edge that occurs just after one rising edge of clock to just
before the next rising edge of the clock. The qualifying phrases “just after” and “just before” are used here to
indicate that the SYSREF transition must occur far enough away from the rising edges of the clock to avoid
setup/hold violations and prevent the device from concluding that the SYSREF transition has crossed out off the
phase tolerance window when in fact it has not. The tolerance range for window “00” is from rising clock edge to
rising clock edge and is indicated in the figure by the green text labeled “tolerance = R
↔R”.
Following the above example, if characterization reveals SYSREF timing centered on θ23 then phase tolerance
window “01” (with tolerance for SYSREF rising edge events from EF to EF) should be chosen. Notice that this
option is tolerant even to rising SYSREF edges that occur after the rising device clock edge (i.e. in θ4) and will
treat them just as if they had occurred in one of the earlier three phases, aligning to the same rising device clock
edge indicated by the red arrow labeled “Window=00/01 Alignment Edge”. This allows the system designer to
tolerate PCB design errors and/or environmental and manufacturing variations – achieving his intended
alignment without having to make physical changes to the board to adjust the SYSREF timing.
Similarly, if characterization indicates that SYSREF timing is centered on θ34 or θ41 then phase tolerance
window “10” or “11” can be selected, resulting in tolerance for “F
↔F” or “ER↔ER” SYSREF timing, respectively.
Note, however, that in these two cases the alignment reference edge is by default taken to be the subsequent
rising edge of the device clock. Since this may not be the desired behavior, the DAC38RFxx allows the user to
program in an optional alignment offset of θ1 if the default offset of 0 does not achieve the desired alignment.
This feature is illustrated in Figure 56 where the user can see that by setting the alignment offset to -1, phase
tolerance windows “10” and “11” can be made to trigger alignment to the earlier rising device clock edge used by
windows “00” and “01”. Alternatively, the window “00” and “01” alignment edge can be pushed one cycle later by
setting their alignment offset to +1.
Figure 56. Optional SYSREF Alignment Offset


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