Page 5

BULK PACKING

DO-15

500

194 * 84 * 20

465 * 220 * 260

25,000

12.9

Formosa MS

SF21 THRU SF28

Document ID

Issued Date

Revised Date

Revision

Page.

DEVICE

CASE

TYPE

Q'TY 1

(PCS / BOX)

INNER

BOX SIZE

CARTON

SIZE

Q'TY 2

(PCS / CARTON)

APPROX.

CROSS

WEIGHT(kg)

(m/m)

(m/m)

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

DS-222407

2008/02/10

2010/05/10

C

6

Suggested thermal profiles for soldering processes

1.Lead free temperature profile wave-soldering

0

20

40

60

80

100 120 140 160 180 200 220 240

Time(Sec)

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

Preheat

Max gradient 2ºC/s

Peak

Max well

time 5 Max

Cool Down

Max gradient-4ºC/s

Suggested gradient 2ºC/s or

less

-

Peak soldering temperature not

to exceed 260ºC

Axial Leaded Super Fast Rectifiers