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RT4532 Datasheet(PDF) 11 Page - Richtek Technology Corporation |
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RT4532 Datasheet(HTML) 11 Page - Richtek Technology Corporation |
11 / 12 page 11 RT4532 DS4532-01 August 2015 www.richtek.com © Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Thermal Considerations For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX) − TA) / θJA where TJ(MAX) is the maximum junction temperature, TAis the ambient temperature, and θJAis the junction to ambient thermal resistance. For recommended operating condition specifications, the maximum junction temperature is 125 °C. The junction to ambient thermal resistance, θJA, is layout dependent. For WL-CSP-10B 0.87x2.07 (BSC) package, the thermal resistance, θJA, is 99.6°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by the following formula : PD(MAX) = (125 °C − 25°C) / (99.6°C/W) = 1W for WL-CSP-10B 0.87x2.07 (BSC) package The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. The derating curve in Figure 1 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. Layout Consideration As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and switching frequencies. If the layout is not carefully done, the regulator might expose noise problems and duty cycle jitter. Therefore, use wide and short traces for high current paths. The input capacitor should be placed as close as possible to the input pin for good input voltage filtering. The inductor should be placed as close as possible to the switch pin to minimize the noise coupling into other circuits. The output capacitor needs to be placed directly from the VOUT pin to GND rather than across the LEDs. This reduces the ripple current in the trace to the LEDs. When doing the PCB layout, the bold traces should be routed first, as well as placement of the inductor, and input and output capacitors. Figure 1. Derating Curve of Maximum Power Dissipation 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 Ambient Temperature (°C) Four-Layer PCB |
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