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MC33981 Datasheet(PDF) 5 Page - Motorola, Inc |
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MC33981 Datasheet(HTML) 5 Page - Motorola, Inc |
5 / 24 page MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 33981 5 MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit ELECTRICAL RATINGS Power Supply Voltage Steady-State VPWR -16 to 41 V Input/Output Terminals Voltage (Note 1) VIN -0.3 to 7.0 V Output Voltage VOUT -5.0 to 41 V Continuous Output Current (Note 2) IOUT 40 A CSNS Input Clamp Current ICSNS 10 mA SR Voltage VSR -0.3 to 54 V Temperature Feedback Voltage VTEMP -0.3 to 5.0 V CBOOT Voltage CBOOT -0.3 to 54 V OCLS Voltage VOCLS -0.3 to 7.0 V Low-Side Gate Voltage VGLS -0.3 to 15 V Low-Side Drain Voltage VDLS -5.0 to 41 V ESD Voltage Human Body Model (Note 3) Machine Model (Note 4) VESD1 VESD2 ±2000 ±200 V Output Clamp Energy (Note 5) ECL TBD J THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -40 to 125 -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Thermal Resistance (Note 6) Junction to Power Die Case Junction to Ambient RθJC RθJA 1.0 20 °C/W Peak Terminal Reflow Temperature During Solder Mounting (Note 7) TSOLDER 240 °C Power Dissipation (TA = 25°C) (Note 8) PD TBD W Notes 1. Exceeding voltage limits on INHS, INLS, CONF, CSNS, FS, TEMP, and EN terminals may cause a malfunction or permanent damage to the device. 2. Continuous high-side output rating as long as maximum junction temperature is not exceeded. Calculation of maximum output current using package thermal resistance is required. 3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 4. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω) and in accordance with the system module specification with a capacitor > 0.01 µF connected from OUT to GND. 5. Active clamp energy using single-pulse method (L = 16 mH, RL = 0, VPWR = 12 V, TJ = 150°C). 6. Device mounted on a 2s2p test board per JEDEC JESD51-2. 7. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 8. Maximum power dissipation at indicated ambient temperature in free air with no heatsink used. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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