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GS82582QT19GE-375 Datasheet(PDF) 10 Page - GSI Technology |
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GS82582QT19GE-375 Datasheet(HTML) 10 Page - GSI Technology |
10 / 26 page Thermal Impedance Package Test PCB Substrate JA (C°/W) Airflow = 0 m/s JA (C°/W) Airflow = 1 m/s JA (C°/W) Airflow = 2 m/s JB (C°/W) JC (C°/W) 165 BGA 4-layer 16.10 13.69 12.73 6.54 2.08 Notes: 1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number. 2. Please refer to JEDEC standard JESD51-6. 3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to the PCB can result in cooling or heating of the RAM depending on PCB temperature. HSTL I/O DC Input Characteristics Parameter Symbol Min Max Units Notes Input Reference Voltage VREF VDDQ /2 – 0.05 VDDQ /2 + 0.05 V — Input High Voltage VIH1 VREF + 0.1 VDDQ + 0.3 V 1 Input Low Voltage VIL1 –0.3 VREF – 0.1 V 1 Input High Voltage VIH2 0.7 * VDDQ VDDQ + 0.3 V 2,3 Input Low Voltage VIL2 –0.3 0.3 * VDDQ V 2,3 Notes: 1. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing. 2. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing. 3. Parameters apply to ZQ during JTAG boundary scan testing only. GS82582QT19/37GE-400/375/333/300 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Rev: 1.03 4/2016 10/25 © 2012, GSI Technology HSTL I/O AC Input Characteristics Parameter Symbol Min Max Units Notes Input Reference Voltage VREF VDDQ /2 – 0.08 VDDQ /2 + 0.08 V — Input High Voltage VIH1 VREF + 0.2 VDDQ + 0.5 V 1,2,3 Input Low Voltage VIL1 –0.5 VREF – 0.2 V 1,2,3 Input High Voltage VIH2 VDDQ – 0.2 VDDQ + 0.5 V 4,5 Input Low Voltage VIL2 –0.5 0.2 V 4,5 Notes: 1. VIH(MAX) and VIL(MIN) apply for pulse widths less than one-quarter of the cycle time. 2. Input rise and fall times must be a minimum of 1 V/ns, and within 10% of each other. 3. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing. 4. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing. 5. Parameters apply to ZQ during JTAG boundary scan testing only. |
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