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5962-9089501MPA Datasheet(PDF) 3 Page - Texas Instruments |
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5962-9089501MPA Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 41 page  TLC2652, TLC2652A, TLC2652Y Advanced LinCMOS PRECISION CHOPPERSTABILIZED OPERATIONAL AMPLIFIERS SLOS019E − SEPTEMBER 1988 − REVISED FEBRUARY 2005 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC2652Y chip information This chip, when properly assembled, displays characteristics similar to the TLC2652C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (7) IS INTERNALLY CONNECTED TO BACK SIDE OF CHIP. FOR THE PINOUT, SEE THE FUNCTIONAL BLOCK DIAGRAM. 90 80 (13) (12) (11) (10) (9) (8) (1) (7) (5) (4) (2) (14) |
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