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OPA196, OPA2196, OPA4196

SBOS869 – JULY 2017

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Product Folder Links: OPA196 OPA2196 OPA4196

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2196

OPA2196

UNIT

8 PINS

D (SOIC)

DGK (VSSOP)

Junction-to-ambient thermal resistance

107.9

158

°C/W

Junction-to-case(top) thermal resistance

53.9

48.6

°C/W

Junction-to-board thermal resistance

48.9

78.7

°C/W

Junction-to-top characterization parameter

6.6

3.9

°C/W

Junction-to-board characterization parameter

48.3

77.3

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4196

OPA4196

UNIT

14 PINS

D (SOIC)

PW (TSSOP)

Junction-to-ambient thermal resistance

86.4

92.6

°C/W

Junction-to-case(top) thermal resistance

46.3

27.5

°C/W

Junction-to-board thermal resistance

41.0

33.6

°C/W

Junction-to-top characterization parameter

11.3

1.9

°C/W

Junction-to-board characterization parameter

40.7

33.1

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W