9

LMK60E2-156M, LMK60E0-156M, LMK60E0-212M

www.ti.com

SNAS718A – DECEMBER 2016 – REVISED JUNE 2017

Product Folder Links: LMK60E2-156M LMK60E0-156M LMK60E0-212M

Submit Documentation Feedback

Copyright © 2016–2017, Texas Instruments Incorporated

8 Power Supply Recommendations

For best electrical performance of LMK60EX, TI recommends using a combination of 10 µF, 1 µF, and 0.1 µF on

its power-supply bypass network. TI also recommends using component side mounting of the power-supply

bypass capacitors and it is best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the

connections between the bypass capacitors and the power supply on the device as short as possible. Ground the

other side of the capacitor using a low impedance connection to the ground plane. Figure 9 shows the layout

recommendation for power supply decoupling of LMK60EX.

9 Layout

9.1 Layout Guidelines

The following sections provides recommendations for board layout, solder reflow profile, and power supply

bypassing when using LMK60EX to ensure good thermal and electrical performance, along with overall signal

integrity of entire system.

9.1.1 Ensuring Thermal Reliability

The LMK60EX is a high-performance device. Therefore, pay careful attention to device configuration and the

printed-circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the

ground plane of the PCB through three vias or more, as shown in Figure 9, to maximize thermal dissipation out

of the package.

Equation 1 describes the relationship between the PCB temperature around the LMK60EX and its junction

temperature.

where

•

•

•

•

P: On-chip power dissipation of LMK60EX

(1)

To ensure that the maximum junction temperature of LMK60EX is below 105°C, it can be calculated that the

maximum PCB temperature without airflow should be at 87°C or below when the device is optimized for best

performance resulting in maximum on-chip power dissipation of 0.36 W.

9.1.2 Best Practices for Signal Integrity

For best electrical performance and signal integrity of entire system with LMK60EX, TI recommends routing vias

into decoupling capacitors and then into the LMK60EX. TI also recommends increasing the via count and width

of the traces wherever possible. These steps ensure lowest impedance and shortest path for high frequency

current flow. Figure 9 shows the layout recommendation for LMK60EX.