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LMK62A2-150M Datasheet(PDF) 9 Page - Texas Instruments |
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LMK62A2-150M Datasheet(HTML) 9 Page - Texas Instruments |
9 / 17 page 9 LMK62E2-156M, LMK62E0-156M, LMK62A2-100M, LMK62A2-150M LMK62A2-156M, LMK62A2-200M, LMK62A2-266M www.ti.com SNAS691B – DECEMBER 2016 – REVISED JUNE 2017 Product Folder Links: LMK62E2-156M LMK62E0-156M LMK62A2-100M LMK62A2-150M LMK62A2-156M LMK62A2- 200M LMK62A2-266M Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 8 Power Supply Recommendations For best electrical performance of LMK62XX, TI recommends using a combination of 10 µF, 1 µF, and 0.1 µF on the power-supply bypass network of the device. TI also recommends using component side mounting of the power-supply bypass capacitors and it is best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low impedance connection to the ground plane. Figure 9 shows the layout recommendation for power supply decoupling of LMK62XX. 9 Layout 9.1 Layout Guidelines The following sections provides recommendations for board layout, solder reflow profile and power supply bypassing when using LMK62XX to ensure good thermal / electrical performance and overall signal integrity of entire system. 9.1.1 Ensuring Thermal Reliability The LMK62XX is a high-performance device. Therefore, pay careful attention to the device configuration and printed-circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more, as shown in Figure 9, to maximize thermal dissipation out of the package. Equation 1 shows the relationship between the PCB temperature around the LMK62XX and the junction temperature. TB = TJ – ΨJB × P where • TB: PCB temperature around the LMK62XX • TJ: Junction temperature of LMK62XX • ΨJB: Junction-to-board thermal resistance parameter of LMK62XX (64.1°C/W without airflow) • P: On-chip power dissipation of LMK62XX (1) To ensure that the maximum junction temperature of LMK62XX is below 105°C, it can be calculated that the maximum PCB temperature without airflow should be at 81°C or below when the device is optimized for best performance, resulting in maximum on-chip power dissipation of 0.36 W. 9.1.2 Best Practices for Signal Integrity For best electrical performance and signal integrity of entire system with LMK62XX, TI recommends routing vias into decoupling capacitors and then into the LMK62XX. TI also recommends increasing the via count and width of the traces wherever possible. These steps ensure lowest impedance and shortest path for high frequency current flow. Figure 9 shows the layout recommendation for LMK62XX. |
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