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LM555-MIL Datasheet(PDF) 4 Page - Texas Instruments |
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LM555-MIL Datasheet(HTML) 4 Page - Texas Instruments |
4 / 18 page 4 LM555-MIL SNAS745 – JUNE 2017 www.ti.com Product Folder Links: LM555-MIL Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (3) For operating at elevated temperatures the device must be derated above 25°C based on a 150°C maximum junction temperature and a thermal resistance of 106°C/W (PDIP), 170°C/W (S0IC-8), and 204°C/W (VSSOP) junction to ambient. (4) Refer to RETS555X drawing of military LM555H and LM555J versions for specifications. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Power Dissipation(3) LM555CM, LM555CN(4) 1180 mW LM555CMM 613 mW Soldering Information PDIP Package Soldering (10 Seconds) 260 °C Small Outline Packages (SOIC and VSSOP) Vapor Phase (60 Seconds) 215 °C Infrared (15 Seconds) 220 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The ESD information listed is for the SOIC package. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500(2) V 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply Voltage 18 V Operating free-air temperature, TA 0 70 °C Operating junction temperature, TJ 70 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LM555-MIL UNIT PDIP SOIC VSSOP 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 106 170 204 °C/W |
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