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CY29FCT520BTDMB Datasheet(PDF) 3 Page - Texas Instruments |
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CY29FCT520BTDMB Datasheet(HTML) 3 Page - Texas Instruments |
3 / 12 page CY29FCT520T MULTILEVEL PIPELINE REGISTER WITH 3-STATE OUTPUTS SCCS011C – MAY 1994 – REVISED NOVEMBER 2001 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic diagram MUX MUX Octal Register A1 Register Controls Instruction I0 I1 CLK S0 S1 D0–D7 Y0–Y7 OE Octal Register A2 Octal Register B1 Octal Register B2 MUX 8 8 Selection Multiplex absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential –0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC input voltage range –0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC output voltage range –0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC output current (maximum sink current/pin) 120 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 1): P package 67 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (see Note 2): SO package 46 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ambient temperature range with power applied, TA –65 °C to 135°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg –65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The package thermal impedance is calculated in accordance with JESD 51-3. 2. The package thermal impedance is calculated in accordance with JESD 51-7. |
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