© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2055_T510_AUTO • 9/19/2016

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Tantalum Surface Mount Capacitors – Automotive Grade

Soldering Process

KEMET’s families of surface mount capacitors are

compatible with wave (single or dual), convection, IR,

or vapor phase reflow techniques. Preheating of these

components is recommended to avoid extreme thermal

stress. KEMET's recommended profile conditions for

convection and IR reflow reflect the profile conditions of the

IPC/J–STD–020D standard for moisture sensitivity testing.

The devices can safely withstand a maximum of three reflow

passes at these conditions.

Please note that although the X/7343–43 case size can

withstand wave soldering, the tall profile (4.3 mm maximum)

dictates care in wave process development.

Hand soldering should be performed with care due to the

difficulty in process control. If performed, care should be

taken to avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder pad,

applying solder between the pad and the termination, until

reflow occurs. Once reflow occurs, the iron should be

removed immediately. “Wiping” the edges of a chip and

heating the top surface is not recommended.

During typical reflow operations, a slight darkening of the

gold-colored epoxy may be observed. This slight darkening is

normal and not harmful to the product. Marking permanency

is not affected by this change.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

100°C

150°C

150°C

200°C

60 – 120 seconds

60 – 120 seconds

3°C/seconds maximum 3°C/seconds maximum

183°C

217°C

60 – 150 seconds

60 – 150 seconds

220°C*

235°C**

250°C*

260°C**

Time within 5°C of Maximum

20 seconds maximum

30 seconds maximum

Time 25°C to Peak

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation

on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip

stock should be used promptly, preferably within three years of receipt.

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak