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T523X157M035APE0507280 Datasheet(PDF) 11 Page - Kemet Corporation |
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T523X157M035APE0507280 Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 19 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2079_SSD • 9/27/2016 11 11 Solid State Drives/High Energy Applications Polymer Electrolytic (KO-CAP®), 6.3 – 35 VDC Soldering Process KEMET’s families of surface mount capacitors are compatible with wave (single or dual), convection, IR, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions. Please note that although the X/7343–43 and O/7360-43 case size can withstand wave soldering, the tall profile (4.3 mm maximum) dictates care in wave process development. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. Once reflow occurs, the iron should be removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended. Profile Feature Pb-Free Assembly Preheat/Soak Temperature Minimum (T Smin) 150°C Temperature Maximum (T Smax) 200°C Time (t s) from Tsmin to Tsmax) 60 – 120 seconds Ramp-up Rate (T L to TP) 3°C/seconds maximum Liquidous Temperature (T L) 217°C Time Above Liquidous (t L) 60 – 150 seconds Peak Temperature (T P) 250°C* 260°C** Time within 5°C of Maximum Peak Temperature (t P) 30 seconds maximum Ramp-down Rate (T P to TL) 6°C/seconds maximum Time 25°C to Peak Temperature 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size O, Y, and X **Case Size B, H, J, M, T, V, and W Storage All KO-Cap Series are shipped in moisture barrier bags (MBBs) with desiccant and humidity indicator card (HIC). These parts are classified as MSL3 (Moisture Sensitivity Level 3) or MSL4 (Moisture Sensitivity Level 4) per IPC/JEDEC J-STD-020 and packaged per IPC/JEDEC J–STD–033. Refer to Table 1 for part type specification. MSL3 specifies a floor time of 168H at 30°C maximum temperature and 60% relative humidity. MSL4 specifies a floor time of 72H at 30°C maximum temperature and 60% relative humidity. Unused capacitors should be sealed in a MBB with fresh desiccant. Calculated shelf life in sealed bag: – 12 months from bag seal date in a storage environment of < 40ºC and humidity < 90% RH – 24 months from bag seal date in a storage environment of < 30ºC and humidity < 70% RH If baking is required, refer to IPC/JEDEC J–STD–033 for bake procedure Time T smin 25 T smax T L T P Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec t P t L t s 25ºC to Peak |
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