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CWR11CH155KCA Datasheet(PDF) 7 Page - Vishay Siliconix

Part # CWR11CH155KCA
Description  Solid Tantalum Chip Capacitors TANTAMOUNT Military, Surface Mount MIL-PRF-55365/8 Qualified
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

CWR11CH155KCA Datasheet(HTML) 7 Page - Vishay Siliconix

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53
CWR11
Vishay Sprague
Document Number 40011
Revision 31-Jan-05
For technical questions, contact tantalum@vishay.com
1.
A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
where,
P =
Power Dissipation in Watts @ + 25°C as given
in the table in Paragraph Number 5 (Power
Dissipation).
RESR = The capacitor Equivalent Series Resistance
at the specified frequency.
2.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
P =
Power Dissipation in Watts @ + 25°C as
given in the table in Paragraph Number 5
(Power Dissipation).
RESR = The capacitor Equivalent Series Resistance
at the specified frequency.
Z =
The capacitor impedance at the specified
frequency.
2.1
The sum of the peak AC voltage plus the DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10% of the DC working voltage at + 25°C.
3.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10% of the DC rating at + 25°C, 5% of the
DC rating at + 85°C and 1% of the DC rating at
+ 125°C.
4.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25°C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
5.
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
Vrms = Z
P
RESR
Vrms = Irms x Z
where,
Irms =
P
RESR
GUIDE TO APPLICATION
Case Code
Maximum Permissible
Power Dissipation
@ + 25
°C
(Watts) in free air
A
B
C
D
0.075
0.085
0.110
0.150
Temperature
Derating Factor
+ 25°C
+ 85°C
+ 125°C
1.0
0.9
0.4
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent
Irms value be
established when calculating permissible operating
levels. (Power Dissipation calculated using + 25°C
temperature rise.)
6.
Printed Circuit Board Materials: Type CWR11
is compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5,
G10, PTFE-fluorocarbon and porcelanized steel).
7.
Attachment:
7.1
Solder Paste: The recommended thickness of the
solder paste after application is .007" ± .001"
[.178mm ± .025mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering
heat. In practice this can be aided by extending
the solder preheat time at temperatures below the
liquidous state of the solder.
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques - vapor phase,
infrared reflow, wave soldering and hot plate
methods. The Soldering Profile chart shows
maximum recommended time/temperature
conditions for soldering. Attachment with a
soldering iron is not recommended due to the
difficulty of controlling temperature and time at
temperature.
8.
Cleaning (Flux Removal) After Soldering: The
CWR11 is compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy solvents
should be avoided since these will attack the epoxy
encapsulation material.
8.1
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence
of the termination. DO NOT EXCEED 9W/l @ 40kHz
for 2 minutes.


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