NGD15N41ACL, NGB15N41ACL, NGP15N41ACL

Characteristic

Symbol

Value

Unit

Single Pulse Collector−to−Emitter Avalanche Energy

250

200

mJ

THERMAL CHARACTERISTICS

Characteristic

Symbol

Value

Unit

Thermal Resistance, Junction to Case

1.4

°C/W

Thermal Resistance, Junction to Ambient

DPAK (Note 1)

100

50

TO−220

62.5

Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 5 seconds

275

°C

ELECTRICAL CHARACTERISTICS

Characteristic

Symbol

Test Conditions

Temperature

Min

Typ

Max

Unit

OFF CHARACTERISTICS

Collector−Emitter Clamp Voltage

150°C

380

410

440

150°C

380

410

440

Zero Gate Voltage Collector Current

−

2.0

20

−

10

40*

−

1.0

10

Reverse Collector−Emitter Leakage Current

−

0.7

2.0

mA

−

12

25*

−

0.1

1.0

Reverse Collector−Emitter Clamp Voltage

27

33

37

30

36

40

25

31

35

Gate−Emitter Clamp Voltage

150°C

11

13

15

Gate−Emitter Leakage Current

150°C

384

640

1000

Gate Resistor

−

150°C

−

70

−

Ω

Gate Emitter Resistor

−

150°C

10

16

26

k

Ω

Gate Threshold Voltage

1.1

1.4

1.9

0.75

1.0

1.4

1.2

1.6

2.1*

Threshold Temperature Coefficient

(Negative)

−

−

−

−

3.4

−

mV/°C

1. When surface mounted to an FR4 board using the minimum recommended pad size.

2. Pulse Test: Pulse Width v 300 μS, Duty Cycle v 2%.

*Maximum Value of Characteristic across Temperature Range.

2

Publication Order Number:

NGD15N41ACL/D

Specifications subject to change without notice. © 2016 Littelfuse, Inc.

December, 2016 − Rev. 9