© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2018_T528 • 5/8/2017 10

10

T528 Low ESL Polymer Electrolytic for CPU/GPU Decoupling

Tape & Reel Packaging Information

KEMET’smoldedchipcapacitorfamiliesarepackagedin8and12mmplastictapeon7"and13"reelsinaccordancewith

EIA Standard 481:EmbossedCarrierTapingofSurfaceMountComponentsforAutomaticHandling.Thispackagingsystem

iscompatiblewithalltape-fedautomaticpick-and-placesystems.

Table 3 – Packaging Quantity

Case Code

Tape Width

(mm)

7" Reel*

13" Reel*

KEMET

EIA

S

3216-12

8

2,500

10,000

T

3528-12

8

2,500

10,000

M

3528-15

8

2,000

8,000

U

6032-15

12

1,000

5,000

L

6032-19

12

1,000

3,000

W

7343-15

12

1,000

3,000

Z

7343-17

12

1,000

3,000

V

7343-20

12

1,000

3,000

A

3216-18

8

2,000

9,000

B

3528-21

8

2,000

8,000

C

6032-28

12

500

3,000

D

7343-31

12

500

2,500

Q

7343-12

12

1,000

3,000

Y

7343-40

12

500

2,000

X

7343-43

12

500

2,000

E/T428P

7360-38

12

500

2,000

H

7360-20

12

1,000

2,500

* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.

Top Tape Thickness

0.10 mm (0.004")

Maximum Thickness

8 mm (0.315")

or

12 mm (0.472")

180 mm (7.0")

or

330 mm (13.0")