© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2018_T528 • 5/8/2017

88

T528 Low ESL Polymer Electrolytic for CPU/GPU Decoupling

Soldering Process

KEMET’sfamiliesofsurfacemountcapacitorsare

compatiblewithwave(singleordual),convection,IR,

orvaporphasereflowtechniques.Preheatingofthese

components is recommended to avoid extreme thermal

stress.KEMET'srecommendedprofileconditionsfor

convectionandIRreflowreflecttheprofileconditionsofthe

IPC/J–STD–020Dstandardformoisturesensitivitytesting.

Thedevicescansafelywithstandamaximumofthreereflow

passes at these conditions.

Please note that although the X/7343–43 case size can

withstandwavesoldering,thetallprofile(4.3mmmaximum)

dictates care in wave process development.

Handsolderingshouldbeperformedwithcareduetothe

difficultyinprocesscontrol.Ifperformed,careshouldbe

taken to avoid contact of the soldering iron to the molded

case.Theironshouldbeusedtoheatthesolderpad,

applyingsolderbetweenthepadandthetermination,until

reflowoccurs.Oncereflowoccurs,theironshouldbe

removedimmediately.“Wiping”theedgesofachipand

heating the top surface is not recommended.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T

100°C

150°C

Temperature Maximum (T

150°C

200°C

Time (t

60 – 120 seconds

60 – 120 seconds

Ramp-upRate(T

3°C/seconds maximum 3°C/seconds maximum

Liquidous Temperature (T

183°C

217°C

TimeAboveLiquidous(t

60 – 150 seconds

60 – 150 seconds

Peak Temperature (T

220°C*

235°C**

250°C*

260°C**

Time within 5°C of Maximum

Peak Temperature (t

20 seconds maximum

30 seconds maximum

Ramp-downRate(T

6°C/seconds maximum 6°C/seconds maximum

Time 25°C to Peak

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

AllKO-CAPseriesareshippedinmoisturebarrierbagswithadesiccantandmoistureindicatorcard.Theseseriesare

classifiedasMSL3(MoistureSensitivityLevel3).Productcontainedwithinthemoisturebarrierbagsshouldbestoredin

normalworkingenvironmentswithtemperaturesnottoexceed40°Candhumiditynotinexcessof90%RH.

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/second

Maximum Ramp Down Rate = 6ºC/second

t

P

t

L

t

s

25ºC to Peak