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T502B685M025AG6210 Datasheet(PDF) 8 Page - Kemet Corporation |
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T502B685M025AG6210 Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 15 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2075_T502 • 10/21/2016 88 Tantalum Surface Mount Capacitors – High Temperature T502 Series MnO2 230°C Time T smin 25 T smax T L T P Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec t P t L t s 25ºC to Peak Soldering Process KEMET’sfamiliesofsurfacemountcapacitorsare compatible with wave (single or dual), convection, IR, orvaporphasereflowtechniques.Preheatingofthese components is recommended to avoid extreme thermal stress.KEMET'srecommendedprofileconditionsfor convectionandIRreflowreflecttheprofileconditionsofthe IPC/J–STD–020D standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflowpassesattheseconditions. Note that although the X/7343–43 case size can withstand wavesoldering,thetallprofile(4.3mmmaximum)dictates care in wave process development. Hand soldering should be performed with care due to the difficultyinprocesscontrol.Ifperformed,careshouldbe taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflowoccurs.Oncereflowoccurs,theironshouldbe removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (ts) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-up Rate (TL to TP) 3°C/secondsmaximum 3°C/secondsmaximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 220°C* 235°C** 250°C* 260°C** Timewithin5°CofMaximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Ramp-down Rate (TP to TL) 6°C/secondsmaximum 6°C/secondsmaximum Time25°CtoPeak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp and tapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensation on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years of receipt. |
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