© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2075_T502 • 10/21/2016

88

Tantalum Surface Mount Capacitors – High Temperature

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak

Soldering Process

KEMET’sfamiliesofsurfacemountcapacitorsare

compatible with wave (single or dual), convection, IR,

orvaporphasereflowtechniques.Preheatingofthese

components is recommended to avoid extreme thermal

stress.KEMET'srecommendedprofileconditionsfor

convectionandIRreflowreflecttheprofileconditionsofthe

IPC/J–STD–020D standard for moisture sensitivity testing.

The devices can safely withstand a maximum of three

reflowpassesattheseconditions.

Note that although the X/7343–43 case size can withstand

wavesoldering,thetallprofile(4.3mmmaximum)dictates

care in wave process development.

Hand soldering should be performed with care due to the

difficultyinprocesscontrol.Ifperformed,careshouldbe

taken to avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder pad,

applying solder between the pad and the termination, until

reflowoccurs.Oncereflowoccurs,theironshouldbe

removed immediately. “Wiping” the edges of a chip and

heating the top surface is not recommended.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

100°C

150°C

150°C

200°C

60 – 120 seconds

60 – 120 seconds

3°C/secondsmaximum 3°C/secondsmaximum

183°C

217°C

60 – 150 seconds

60 – 150 seconds

220°C*

235°C**

250°C*

260°C**

Timewithin5°CofMaximum

20 seconds maximum

30 seconds maximum

Time25°CtoPeak

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on

the package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp and

tapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum

storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensation

on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip

stock should be used promptly, preferably within three years of receipt.