© 2016 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 05/02/16

12 Amp Standard SCRs

Soldering Parameters

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (LiquidusTemp)

(T

5°C/second max

T

5°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

280°C

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Physical Specifications

Environmental Specifications

Test

Specifications and Conditions

AC Blocking

MIL-STD-750, M-1040, Cond A Applied

Peak AC voltage @ 125°C for 1008 hours

Temperature Cycling

MIL-STD-750, M-1051,

100 cycles; -40°C to +150°C; 15-min

dwell-time

Temperature/

Humidity

EIA / JEDEC, JESD22-A101

1008 hours; 320V - DC: 85°C; 85%

rel humidity

High Temp Storage

MIL-STD-750, M-1031,

1008 hours; 150°C

Low-Temp Storage

1008 hours; -40°C

Resistance to

Solder Heat

MIL-STD-750 Method 2031

Solderability

ANSI/J-STD-002, category 3, Test A

Lead Bend

MIL-STD-750, M-2036 Cond E

Terminal Finish

100% Matte Tin-plated

Body Material

UL recognized epoxy meeting flammability

classification 94V-0

Lead Material

Copper Alloy

Design Considerations

Careful selection of the correct device for the application’s

operating parameters and environment will go a long way

toward extending the operating life of the Thyristor. Good

design practice should limit the maximum continuous

current through the main terminals to 75% of the device

rating. Other ways to ensure long life for a power discrete

semiconductor are proper heat sinking and selection of

voltage ratings for worst case conditions. Overheating,

overvoltage (including dv/dt), and surge currents are

the main killers of semiconductors. Correct mounting,

soldering, and forming of the leads also help protect

against component damage.