SGM8651/2/4

50MHz, Rail-to-Rail Output

SGM8653/5

CMOS Operational Amplifiers

2

SG Micro Corp

www.sg-micro.com

PACKAGE/ORDERING INFORMATION

MODEL

CHANNEL

ORDER NUMBER

PACKAGE

DESCRIPTION

PACKAGE

OPTION

MARKING

INFORMATION

SGM8651XN5/TR

SOT-23-5

Tape and Reel, 3000

8651

SGM8651

Single

SGM8651XS/TR

SOIC-8

Tape and Reel, 2500

SGM8651XS

SGM8652XMS/TR

MSOP-8

Tape and Reel, 3000

SGM8652XMS

SGM8652

Dual

SGM8652XS/TR

SOIC-8

Tape and Reel, 2500

SGM8652XS

SGM8653XN6/TR

SOT-23-6

Tape and Reel, 3000

8653

SGM8653

Single

with Shutdown

SGM8653XS/TR

SOIC-8

Tape and Reel, 2500

SGM8653XS

SGM8654XS14/TR

SOIC-14

Tape and Reel, 2500

SGM8654XS14

SGM8654

Quad

SGM8654XTS14/TR

TSSOP-14

Tape and Reel, 3000

SGM8654XTS14

SGM8655

Dual

with Shutdown

SGM8655XMS/TR

MSOP-10

Tape and Reel, 3000

SGM8655XMS

 

 

ABSOLUTE MAXIMUM RATINGS

Common Mode Input Voltage

Storage Temperature Range..............................-65

℃ to +150℃

Junction Temperature .......................................................160

℃

Operating Temperature Range......................... -55

℃ to +150℃

℃

℃/W

℃/W

℃/W

℃/W

℃/W

Lead Temperature (Soldering 10sec)............................... 260

℃

ESD Susceptibility

HBM..................................................................................1000V

MM......................................................................................400V

NOTE:

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections

of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

CAUTION

This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all

integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause

damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

SGMICRO reserves the right to make any change in circuit design, specification or other related things if necessary without notice at

any time. Please contact SGMICRO sales office to get the latest datasheet.