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C1812C104M3GACAUTO Datasheet(PDF) 10 Page - Kemet Corporation |
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C1812C104M3GACAUTO Datasheet(HTML) 10 Page - Kemet Corporation |
10 / 18 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 1/9/2017 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade) Soldering Process Recommended Soldering Technique: •SolderwaveorsolderreflowforEIAcasesizes0603,0805and1206 •AllotherEIAcasesizesarelimitedtosolderreflowonly Recommended Reflow Soldering Profile: KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual), convection,IRorvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal stress.KEMET’srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/ J-STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereflowpasses attheseconditions. Storage and Handling Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres, andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum storagehumiditynotexceed70%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock shouldbeusedpromptly,preferablywithin1.5yearsofreceipt. Profile Feature Termination Finish SnPb 100%MatteSn Preheat/Soak TemperatureMinimum(T Smin) 100°C 150°C TemperatureMaximum(T Smax) 150°C 200°C Time(t S)fromTSmin to TSmax 60–120seconds 60–120seconds Ramp-UpRate(T L to TP) 3°C/second maximum 3°C/second maximum LiquidousTemperature(T L) 183°C 217°C TimeAboveLiquidous(t L) 60–150seconds 60–150seconds PeakTemperature(T P) 235°C 260°C TimeWithin5°CofMaximum PeakTemperature(t P) 20seconds maximum 30seconds maximum Ramp-DownRate(T P to TL) 6°C/second maximum 6°C/second maximum Time25°CtoPeak Temperature 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time T smin 25 T smax T L T P Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec t P t L t s 25ºC to Peak |
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