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CS53L30 Datasheet(PDF) 65 Page - Cirrus Logic |
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CS53L30 Datasheet(HTML) 65 Page - Cirrus Logic |
65 / 67 page DS992F2 65 CS53L30 10 Package Dimensions 10 Package Dimensions 10.1 WLCSP Package Figure 10-1. 30-Ball WLCSP Package Drawing Table 10-1. WLCSP Package Dimensions Dim Dimensions (Millimeters) Min Nom Max A 0.450 0.505 0.560 A1 0.170 0.200 0.230 A2 0.280 0.305 0.330 M BSC 2.000 BSC N BSC 1.600 BSC b 0.230 0.260 0.290 c REF 0.306 REF d REF 0.306 REF e BSC 0.400 BSC X 2.593 2.613 2.633 Y 2.193 2.213 2.233 ccc = 0.05 ddd = 0.15 WAFER BACK SIDE SIDE VIEW BUMP SIDE e N Y A A2 A1 M X c d Ball A1 Ball A1 Location Indicator b e Seating plane Ball A1 location indicator (seen through package) Z X X øb Øddd Z X Y Øccc Z Notes: • Dimensioning and tolerances per ASME Y 14.5M–1994. • The Ball A1 position indicator is for illustration purposes only and may not be to scale. • Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body and the seating plane datum Z. |
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