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C062H105M5R5GA7303 Datasheet(PDF) 7 Page - Kemet Corporation |
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C062H105M5R5GA7303 Datasheet(HTML) 7 Page - Kemet Corporation |
7 / 13 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1074_HT_X7R_RADIAL_MOLDED • 8/10/2016 7 Radial Through-Hole Multilayer Ceramic Capacitors High Temperature 200°C, Radial, Molded, X7R Dielectric, 50 – 200 VDC (Industrial Grade) Table 2 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Solderability J–STD–002 Method A at 235°C, category 3 Temperature Cycling JESD22 Method JA–104 50 cycles (−55°C to 220°C), measurement at 24 ±4 hours after test conclusion. 30 minutes maximum dwell time at each temperature extreme. 8 minutes maximum transition time. Biased Humidity MIL–STD–202 Method 103 Load humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Low volt humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Immersion MIL–STD–202 Method 104 Test condition B Storage Life MIL–STD–202 Method 108 Unpowered 1,000 hours at 200°C. Measurement at 24 hours ±4 hours after test conclusion. IR Measurement at 150°C High Temperature Life MIL–STD–202 Method 108 1,000 hours at 200°C with rated voltage applied. High Temperature Lead Pull KEMET Defined Test Peel to Failure (25ºC and 200ºC): 4 lbs (1.84 kg) minimum Vibration MIL–STD–202 Method 204 5g for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB. 031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2000 Hz. Resistance to Soldering Heat MIL–STD–202 Method 210 Test Condition B, Solder dip. Note: no preheat of samples. Terminal Strength MIL–STD–202 Method 211 Test Condition A. 454g 5 – 10 s; Bend test © 227g, 3 bends Mechanical Shock MIL–STD–202 Method 213 Test Condition D. Figure 1 of Method 213. Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical – OKEM Clean or equivalent. Storage & Handling The un-mounted storage life of a through-hole (leaded) ceramic capacitor is dependent upon storage and atmospheric conditions as well as packaging materials. While the ceramic chips enveloped under the epoxy coating themselves are quite robust in most environments, solderability of the wire lead on the final epoxy-coated product will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature and exposure to direct sunlight–reels may soften or warp, and tape peel force may increase. KEMET recommends storing the un-mounted capacitors in their original packaging, in a location away from direct sunlight, and where the temperature and relative humidity do not exceed 40 degrees centigrade and 70% respectively. For optimum solderability, capacitor stock should be used promptly, preferably within 18 months of receipt. For applications requiring pre-tinning of components, storage life may be extended if solderability is verified. Before cleaning, bonding or molding these devices, it is important to verify that your process does not affect product quality and performance. KEMET recommends testing and evaluating the performance of a cleaned, bonded or molded product prior to implementing and/or qualifying any of these processes. |
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