74LVC1G58GM datasheet(2/18 Pages) PHILIPS

Part #	74LVC1G58GM

Description	Low-power configurable multiple function gate

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Manufacturer	PHILIPS [NXP Semiconductors]

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2 / 18 page

9397 750 13852

Product data sheet

Rev. 01 — 15 September 2004

2 of 18

Philips Semiconductors

74LVC1G58

Low-power conﬁgurable multiple function gate

3.

Quick reference data

[1]

CPD is used to determine the dynamic power dissipation (PD in µW).

PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where:

fi = input frequency in MHz;

fo = output frequency in MHz;

CL = output load capacitance in pF;

VCC = supply voltage in Volts;

N = total load switching outputs;

Σ(C

L × VCC

2

× f

o) = sum of the outputs.

[2]

The condition is VI = GND to VCC.

4.

Ordering information

5.

Marking

Table 1:

Quick reference data

GND = 0 V; Tamb =25 °C; tr =tf ≤ 2.5 ns.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

tPHL, tPLH propagation delay

input A, B and

C to output Y

VCC = 1.8 V; CL =30pF;

RL =1kΩ

-6

-ns

VCC = 2.5 V; CL =30pF;

RL = 500 Ω

-

3.5

-

ns

VCC = 2.7 V; CL =50pF;

RL = 500 Ω

-

4.2

-

ns

VCC = 3.3 V; CL =50pF;

RL = 500 Ω

-

3.8

-

ns

VCC = 5.0 V; CL =50pF;

RL = 500 Ω

-

3.0

-

ns

CI

input capacitance

-

2.5

-

pF

CPD

power dissipation

capacitance per buffer

VCC = 3.3 V

[1] [2] -20

-

pF

Table 2:

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74LVC1G58GW

−40 °C to +125 °C

SC-88

plastic surface mounted package; 6 leads

SOT363

74LVC1G58GV

−40 °C to +125 °C

SC-74

plastic surface mounted package; 6 leads

SOT457

74LVC1G58GM

−40 °C to +125 °C

XSON6

plastic extremely thin small outline package; no

leads; 6 terminals; body 1

× 1.45 × 0.5 mm

SOT886

Table 3:

Marking

Type number

Marking code

74LVC1G58GW

YK

74LVC1G58GV

V58

74LVC1G58GM

YK

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